---
title: "Ansys 2024 R2: Signal, Power, and Thermal Integrity"
description: "The simulation capabilities for signal and power integrity, electrothermal problems, and thermal management have evolved significantly ➤ Register now: CADFEM Live Webinar Ansys 2024 R2 Highlights!"
image: https://blog.cadfem.net/hubfs/TOPICS/GLOBAL_Blog/Release_2024_R2/PUB_Interview_2024R2_SiPiTh_FW_Teaser.jpg
---

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# Ansys 2024 R2: Signal, Power, and Thermal Integrity

[Frank Weiand](https://blog.cadfem.net/en/author/frank-weiand)  11.09.2024

[Electronics](https://blog.cadfem.net/en/tag/electronics) [CADFEM Release Notes](https://blog.cadfem.net/en/tag/cadfem-release-notes)

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The current release Ansys 2024 R2 offers a wealth of new functions and workflows, especially for simulating signal integrity, electrical-thermal tasks and thermal management.

In the new version of Ansys Electronics Desktop, there are important innovations for the simulation of printed circuit boards. The SIwave solvers support the connection of ECAD to ECAD models, so that a package can be simulated on a PCB. Also the connection from MCAD to ECAD is supported, a feature that allows you to simulate a connector on a printed circuit board. 

In the electrothermal workflow, the currents for PWM applications are determined more precisely and the coupling between Q3D and Icepak is now bidirectional. 

A highlight for Icepak is the Thermal Mesh Fusion method, which uses geometry-based subdomains for mesh refinement and heat sinks are automatically given a suitable mesh.

[**Contact**](https://www.cadfem.net/en/about-us/cadfem-contacts/contact-us.html) us or take a look at our **[CADFEM webinars](https://www.cadfem.net/en/cadfem-informs/newsroom/ansys-release.html#c245572)** on the new release for further advice and answers to your questions.

[All CADFEM update webinars at a glance](https://www.cadfem.net/en/cadfem-informs/newsroom/ansys-release.html#c245572)

![](https://blog.cadfem.net/hubfs/TOPICS/GLOBAL_Blog/Autoren%20Bilder/Portrait_FW_Blog.jpg)

### Author

##### **Frank Weiand**

CADFEM Germany GmbH

+49 (0)8092 7005-890  
[fweiand@cadfem.de](mailto:fweiand@cadfem.de)

![](https://blog.cadfem.net/hubfs/TOPICS/GLOBAL_Blog/Autoren%20Bilder/Portrait_KKU_Blog.jpg)

### Editor

##### **Klaus Kuboth**

CADFEM Germany GmbH

+49 (0)8092 7005-279  
[kkuboth@cadfem.de](mailto:kkuboth@cadfem.de)

 Contact the editorial team  Subscribe to newsletter

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<https://blog.cadfem.net/en/emfc-scale-how-simulation-makes-temperature-drift-visible>[Structures](https://blog.cadfem.net/en/tag/structures) [Fluids & Thermal Management](https://blog.cadfem.net/en/tag/fluids-thermal-management) [Electronics](https://blog.cadfem.net/en/tag/electronics) [TechArticle](https://blog.cadfem.net/en/tag/techarticle)

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[![Temperature distribution in the cross section of the weld spot. | © CADFEM Germany GmbH](https://blog.cadfem.net/hubfs/topics/GLOBAL_Blog/Blog%20Artikel%202026/2605%20Widerstandsschweissen/Blog_Widerstandsschweissen_Teaser.png)](https://blog.cadfem.net/en/multiphysics-simulation-holistic-analysis-of-complex-manufacturing-processes)

<https://blog.cadfem.net/en/multiphysics-simulation-holistic-analysis-of-complex-manufacturing-processes>[Structures](https://blog.cadfem.net/en/tag/structures) [Fluids & Thermal Management](https://blog.cadfem.net/en/tag/fluids-thermal-management) [Electronics](https://blog.cadfem.net/en/tag/electronics) [Insights](https://blog.cadfem.net/en/tag/insights)

#### [Multiphysics Simulation: Holistic Analysis of Complex Manufacturing Processes](https://blog.cadfem.net/en/multiphysics-simulation-holistic-analysis-of-complex-manufacturing-processes)

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