In the new version of Ansys Electronics Desktop, there are important innovations for the simulation of printed circuit boards. The SIwave solvers support the connection of ECAD to ECAD models, so that a package can be simulated on a PCB. Also the connection from MCAD to ECAD is supported, a feature that allows you to simulate a connector on a printed circuit board. 

In the electrothermal workflow, the currents for PWM applications are determined more precisely and the coupling between Q3D and Icepak is now bidirectional. 

A highlight for Icepak is the Thermal Mesh Fusion method, which uses geometry-based subdomains for mesh refinement and heat sinks are automatically given a suitable mesh.

Contact us or take a look at our CADFEM webinars on the new release for further advice and answers to your questions.

All CADFEM update webinars at a glance